Seagate ST32430N/ND Spezifikationen

T tal Plant Application Module X Service AX13-410

Table of Contents 3/96 Application Module X Service viiiHoneywell Inc. 10.2 CD-ROM Physical Configuration and CablingCD-ROM pinning (without DAT dr

90 Application Module X Service 3/96Honeywell Inc. TAC Access to Coprocessor 7.2 Communications Modem Description and Configuration 7.2 Communicatio

TAC Access to Coprocessor 7.2 Communications Modem Description and Configuration3/96 Application Module X Service 91Honeywell Inc. Modem Configuratio

92 Application Module X Service 3/96Honeywell Inc. TAC Access to Coprocessor 7.2 Communications Modem Description and Configuration Modem register c

TAC Access to Coprocessor 7.3 Modem Connection3/96 Application Module X Service 93Honeywell Inc. 7.3 Modem Connection Overview An interface cable mu

94 Application Module X Service 3/96Honeywell Inc. TAC Access to Coprocessor 7.3 Modem Connection Modem connection procedure for U.S. Robotics Sport

TAC Access to Coprocessor 7.3 Modem Connection3/96 Application Module X Service 95Honeywell Inc. 5 Ensure modem power is on. 6 The communications li

TAC Access to Coprocessor 7.3 Modem Connection3/96 Application Module X Service 96Honeywell Inc.

3/96 Application Module X Service 97Honeywell Inc. Section 8—HP 712/60 PA RISC Desktop Workstation8.1 HP 712/60 Workstation in A X M Environment Ove

98 Application Module X Service 3/96Honeywell Inc. HP 712/60 PA RISC Desktop Workstation 8.1 HP 712/60 Workstation in AXM Environment HP 712/60 work

3/96 Application Module X Service 99Honeywell Inc. Section 9—DAT DRIVE IntroductionDAT drive purpose A directly connected Digital Audio Tape (DAT) d

3/96 Application Module X Service 1Honeywell Inc. Application Module X Service Manual Section 1—Introduction1.1 About this Document BasicsProduc

100 Application Module X Service 3/96Honeywell Inc. DAT DRIVE 9.1 DAT Drive Indicators 9.1 DAT Drive Indicators DAT indicator definition The DAT driv

DAT DRIVE 9.2 Preventive Maintenance3/96 Application Module X Service 101Honeywell Inc. 9.2 Preventive Maintenance DAT head cleaning The DAT drive h

102 Application Module X Service 3/96Honeywell Inc. DAT DRIVE 9.3 DAT Drive Physical Configuration and Cabling 9.3 DAT Drive Physical Configuration a

DAT DRIVE 9.3 DAT Drive Physical Configuration and Cabling3/96 Application Module X Service 103Honeywell Inc. DAT SCSI interface termination The ter

104 Application Module X Service 3/96Honeywell Inc. DAT DRIVE 9.3 DAT Drive Physical Configuration and Cabling DAT option switches Internal DAT driv

DAT DRIVE 9.3 DAT Drive Physical Configuration and Cabling3/96 Application Module X Service 105Honeywell Inc. DAT drive cabling The optional DAT dri

106 Application Module X Service 3/96Honeywell Inc. DAT DRIVE 9.3 DAT Drive Physical Configuration and Cabling DAT connection (with CD-ROM) The foll

DAT DRIVE 9.4 DAT Replacement3/96 Application Module X Service 107Honeywell Inc. 9.4 DAT Replacement Overview Node power must be turned off for the

108 Application Module X Service 3/96Honeywell Inc. DAT DRIVE 9.4 DAT Replacement 5 Remove the power connector from the rear of the device. 6 Remove

3/96 Application Module X Service 109Honeywell Inc. Section 10—CD-ROM Drive10.1 Introduction CD-ROM purpose A directly connected CD-ROM drive is an

2 Application Module X Service 3/96Honeywell Inc. Introduction 1.2 References for More Information 1.2 References for More Information The following

110 Application Module X Service 3/96Honeywell Inc. CD-ROM Drive 10.2 CD-ROM Physical Configuration and Cabling 10.2 CD-ROM Physical Configuration an

CD-ROM Drive 10.2 CD-ROM Physical Configuration and Cabling3/96 Application Module X Service 111Honeywell Inc. CD-ROM power Power to the CD-ROM driv

112 Application Module X Service 3/96Honeywell Inc. CD-ROM Drive 10.2 CD-ROM Physical Configuration and Cabling CD-ROM connection (with DAT drive) T

CD-ROM Drive 10.3 CD-ROM Replacement3/96 Application Module X Service 113Honeywell Inc. 10.3 CD-ROM Replacement Overview Node power must be turned o

114 Application Module X Service 3/96Honeywell Inc. CD-ROM Drive 10.3 CD-ROM Replacement 5 Remove the power connector from the rear of the device. 6

3/96 Application Module X Service 115Honeywell Inc. Section 11—Spare Parts11.1 Overview Organization of this section This section lists the field rep

116 Application Module X Service 3/96Honeywell Inc. Spare Parts 11.2 Basic 5-Slot Module Parts 11.2 Basic 5-Slot Module Parts Basic 5-slot parts lis

Spare Parts 11.2 Basic 5-Slot Module Parts3/96 Application Module X Service 117Honeywell Inc. Non-CE compliant 51308066-200Power cord 220 V 50/60 Hz

118 Application Module X Service 3/96Honeywell Inc. Spare Parts 11.3 Basic 10-Slot Module Parts 11.3 Basic 10-Slot Module Parts Basic 10-slot parts

Spare Parts 11.4 LCN Node Processor Parts3/96 Application Module X Service 119Honeywell Inc. 11.4 LCN Node Processor Parts Node processor parts list

3/96 Application Module X Service 3Honeywell Inc. Section 2—Application Module X Overview2.1 A X M Functionality General introduction The Applicati

120 Application Module X Service 3/96Honeywell Inc. Spare Parts 11.5 Coprocessor and Related Parts 11.5 Coprocessor and Related Parts WSI2 and WSI2

Spare Parts 11.5 Coprocessor and Related Parts3/96 Application Module X Service 121Honeywell Inc. Coprocessor memory and battery The following page

122 Application Module X Service 3/96Honeywell Inc. Spare Parts 11.5 Coprocessor and Related Parts Coprocessor console terminal/modem cables Table 1

Spare Parts 11.6 Hard Disk Drive Tray and Drive Parts3/96 Application Module X Service 123Honeywell Inc. 11.6 Hard Disk Drive Tray and Drive Parts T

124 Application Module X Service 3/96Honeywell Inc. Spare Parts 11.7 DAT Tape and Associated Parts 11.7 DAT Tape and Associated Parts IntroductionDA

Spare Parts 11.7 DAT Tape and Associated Parts3/96 Application Module X Service 125Honeywell Inc. DAT drive in classic furniture station The followi

126 Application Module X Service 3/96Honeywell Inc. Spare Parts 11.8 CD-ROM and Associated Parts 11.8 CD-ROM and Associated Parts IntroductionCD-ROM

Spare Parts 11.8 CD-ROM and Associated Parts3/96 Application Module X Service 127Honeywell Inc. CD-ROM in classic furniture station The following ta

128 Application Module X Service 3/96Honeywell Inc. Spare Parts 11.8 CD-ROM and Associated Parts

Index 3/96 Application Module X Service 129Honeywell Inc. Numerics 1 GB DEC drive SCSI address pinning 59 1 GB DEC drive SCSI termination pinning

4 Application Module X Service 3/96Honeywell Inc. Application ModuleX Overview 2.1 AXM Functionality Functionality diagram The following diagram ill

Index3/96 Application ModuleX Service 130Honeywell Inc.HMPU Indicators 16HMPU Processor and Associated Boards 16HP 712/60 PA RISC Desktop Workstation

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Application ModuleX Overview 2.2 Hardware Organization3/96 Application Module X Service 5Honeywell Inc. 2.2 Hardware Organization A X M hardware blo

6 Application Module X Service 3/96Honeywell Inc. Application ModuleX Overview 2.2 Hardware Organization K2LCN hardware version HMPU hardware versio

Application ModuleX Overview 2.3 Board Slot Definition3/96 Application Module X Service 7Honeywell Inc. 2.3 Board Slot Definition Overview of chassis

8 Application Module X Service 3/96Honeywell Inc. Application ModuleX Overview 2.3 Board Slot Definition Ten-slot board placement The following two

Application ModuleX Overview 2.3 Board Slot Definition3/96 Application Module X Service 9Honeywell Inc. * Two versions of the WSI2 board are availab

10 Application Module X Service 3/96Honeywell Inc. Application ModuleX Overview 2.4 Power Supply 2.4 Power Supply Introduction The A X M node contai

Application ModuleX Overview 2.4 Power Supply3/96 Application Module X Service 11Honeywell Inc. Node power supply diagram The following diagram show

12 Application Module X Service 3/96Honeywell Inc. Application ModuleX Overview 2.4 Power Supply

3/96 Application Module X Service 13Honeywell Inc. Section 3—Hardware Description of LCN Node Processors3.1 K2LCN-X Node Processor Overview The K2LC

14 Application Module X Service 3/96Honeywell Inc. Hardware Description of LCN Node Processors 3.1 K2LCN-X Node Processor Indicator description The

Hardware Description of LCN Node Processors 3.1 K2LCN-X Node Processor3/96 Application Module X Service 15Honeywell Inc. K2LCN pinning The K2LCN has

16 Application Module X Service 3/96Honeywell Inc. Hardware Description of LCN Node Processors 3.2 HMPU Processor and Associated Boards 3.2 HMPU Pro

Hardware Description of LCN Node Processors 3.2 HMPU Processor and Associated Boards3/96 Application Module X Service 17Honeywell Inc. Self-Test Err

18 Application Module X Service 3/96Honeywell Inc. Hardware Description of LCN Node Processors 3.2 HMPU Processor and Associated Boards LLCN board f

Hardware Description of LCN Node Processors 3.2 HMPU Processor and Associated Boards3/96 Application Module X Service 19Honeywell Inc. QMEM-X board

T tal Plant Application Module X Application Module X Service AX13-410Release 100/110/200CE Compliant3/96

20 Application Module X Service 3/96Honeywell Inc. Hardware Description of LCN Node Processors 3.2 HMPU Processor and Associated Boards Sing Bit On

Hardware Description of LCN Node Processors 3.3 CLCN A/B I/O (or LCN I/O) Board3/96 Application Module X Service 21Honeywell Inc. 3.3 CLCN A/B I/O (

22 Application Module X Service 3/96Honeywell Inc. Hardware Description of LCN Node Processors 3.3 CLCN A/B I/O (or LCN I/O) Board LCN cable connect

Hardware Description of LCN Node Processors 3.4 Node Processor Related Board Replacement3/96 Application Module X Service 23Honeywell Inc. 3.4 Node

24 Application Module X Service 3/96Honeywell Inc. Hardware Description of LCN Node Processors 3.4 Node Processor Related Board Replacement Board re

3/96 Application Module X Service 25Honeywell Inc. Section 4—Hardware Description of Coprocessor4.1 WSI2 Board Description Overview The basic WSI2 b

26 Application Module X Service 3/96Honeywell Inc. Hardware Description of Coprocessor 4.1 WSI2 Board Description WSI2 board indicators (LEDs) and s

Hardware Description of Coprocessor 4.1 WSI2 Board Description3/96 Application Module X Service 27Honeywell Inc. WSI2 board pinning The WSI2 board h

28 Application Module X Service 3/96Honeywell Inc. Hardware Description of Coprocessor 4.1 WSI2 Board Description Coprocessor battery location The f

Hardware Description of Coprocessor 4.1 WSI2 Board Description3/96 Application Module X Service 29Honeywell Inc. Coprocessor memory option (32 megab

3/96 Application Module X iiHoneywell Inc. Copyright, Notices, and Trademarks Printed in U.S.A. –  Copyright 1995 by Honeywell Inc.Revision 06– 3/

30 Application Module X Service 3/96Honeywell Inc. Hardware Description of Coprocessor 4.1 WSI2 Board Description Coprocessor memory option (64 mega

Hardware Description of Coprocessor 4.1 WSI2 Board Description3/96 Application Module X Service 31Honeywell Inc.5116564 Megabytes(Each Board)

32 Application Module X Service 3/96Honeywell Inc. Hardware Description of Coprocessor 4.1 WSI2 Board Description Coprocessor memory option (265 meg

Hardware Description of Coprocessor 4.1 WSI2 Board Description3/96 Application Module X Service 33Honeywell Inc. Coprocessor free edge The illustrat

34 Application Module X Service 3/96Honeywell Inc. Hardware Description of Coprocessor 4.1 WSI2 Board Description Coprocessor PIN connection details

Hardware Description of Coprocessor 4.1 WSI2 Board Description3/96 Application Module X Service 35Honeywell Inc. Coprocessor SCSI interface details

36 Application Module X Service 3/96Honeywell Inc. Hardware Description of Coprocessor 4.1 WSI2 Board Description Honeywell provides the appropriate

Hardware Description of Coprocessor 4.2 WSI2 I/O Board Description3/96 Application Module X Service 37Honeywell Inc. 4.2 WSI2 I/O Board Description

38 Application Module X Service 3/96Honeywell Inc. Hardware Description of Coprocessor 4.3 Media Access Unit (MAU) Description 4.3 Media Access Unit

Hardware Description of Coprocessor 4.3 Media Access Unit (MAU) Description3/96 Application Module X Service 39Honeywell Inc. Media Access Unit conn

Table of Contents 3/96 Application Module X Service iiiHoneywell Inc. SECTION 1—INTRODUCTION ...

40 Application Module X Service 3/96Honeywell Inc. Hardware Description of Coprocessor 4.4 WSI2 Board Replacement 4.4 WSI2 Board Replacement Overvie

Hardware Description of Coprocessor4.4 WSI2 Board Replacement3/96 Application ModuleX Service 41Honeywell Inc.5 Ensure that the replacement WSI2 assem

42 Application ModuleX Service 3/96Honeywell Inc.Hardware Description of Coprocessor4.4 WSI2 Board Replacement13 Having obtained the new hardware iden

Hardware Description of Coprocessor4.5 WSI2 I/O Board replacement3/96 Application ModuleX Service 43Honeywell Inc.4.5 WSI2 I/O Board replacementOvervi

44 Application ModuleX Service 3/96Honeywell Inc.Hardware Description of Coprocessor4.5 WSI2 I/O Board replacement4 Insert the replacement board and s

Hardware Description of Coprocessor4.6 Media Access Unit Replacement Procedure3/96 Application ModuleX Service 45Honeywell Inc.4.6 Media Access Unit R

46 Application ModuleX Service 3/96Honeywell Inc.Hardware Description of Coprocessor4.6 Media Access Unit Replacement Procedure

3/96 Application Module X Service 47Honeywell Inc. Section 5—Hard Disk Drive Tray5.1 Drive Tray Description Overview The Hard Disk Drive Tray (HDDT)

48 Application Module X Service 3/96Honeywell Inc. Hard Disk Drive Tray 5.1 Drive Tray Description Disk drive physical placement and connections The

Hard Disk Drive Tray 5.1 Drive Tray Description3/96 Application Module X Service 49Honeywell Inc. Drive connection detail The following illustration

Table of Contents 3/96 Application Module X Service ivHoneywell Inc. 3.4 Node Processor Related Board ReplacementOverview ...

50 Application Module X Service 3/96Honeywell Inc. Hard Disk Drive Tray 5.1 Drive Tray Description Disk drives Several types of disk drives are avai

Hard Disk Drive Tray 5.1 Drive Tray Description3/96 Application Module X Service 51Honeywell Inc. Considerations for ordering replacement drives The

52 Application Module X Service 3/96Honeywell Inc. Hard Disk Drive Tray 5.1 Drive Tray Description If the optional second drive is replaced with a d

Hard Disk Drive Tray 5.2 525 MB Quantum Disk Drive (LPS525S)3/96 Application Module X Service 53Honeywell Inc. 5.2 525 MB Quantum Disk Drive (LPS525

54 Application Module X Service 3/96Honeywell Inc. Hard Disk Drive Tray 5.2 525 MB Quantum Disk Drive (LPS525S)40032Pin as Shown (For Both Drives)De

Hard Disk Drive Tray 5.3 525 MB Seagate Drive (ST3600N)3/96 Application Module X Service 55Honeywell Inc. 5.3 525 MB Seagate Drive (ST3600N) Introdu

56 Application Module X Service 3/96Honeywell Inc. Hard Disk Drive Tray 5.3 525 MB Seagate Drive (ST3600N) The following diagram is the same as the

Hard Disk Drive Tray 5.3 525 MB Seagate Drive (ST3600N)3/96 Application Module X Service 57Honeywell Inc. 525 MB Seagate drive SCSI interface termin

58 Application Module X Service 3/96Honeywell Inc. Hard Disk Drive Tray 5.3 525 MB Seagate Drive (ST3600N) 525 MB Seagate drive termination/parity p

Hard Disk Drive Tray 5.4 1.2 GB Digital Equipment Corp. Drive (DSP3107L)3/96 Application Module X Service 59Honeywell Inc. 5.4 1.2 GB Digital Equipm

Table of Contents 3/96 Application Module X Service vHoneywell Inc. SECTION 5—HARD DISK DRIVE TRAY ...

60 Application Module X Service 3/96Honeywell Inc. Hard Disk Drive Tray 5.4 1.2 GB Digital Equipment Corp. Drive (DSP3107L) 1.2 GB DEC drive SCSI ad

Hard Disk Drive Tray 5.5 1.2 GB Quantum Drive (LPS1080S)3/96 Application Module X Service 61Honeywell Inc. 5.5 1.2 GB Quantum Drive (LPS1080S) Intro

62 Application Module X Service 3/96Honeywell Inc. Hard Disk Drive Tray 5.5 1.2 GB Quantum Drive (LPS1080S) SCSI address pinning (address 5) The dia

Hard Disk Drive Tray 5.6 1.2 GB Quantum Drive (VP31110)3/96 Application Module X Service 63Honeywell Inc. 5.6 1.2 GB Quantum Drive (VP31110) Introdu

64 Application Module X Service 3/96Honeywell Inc. Hard Disk Drive Tray 5.6 1.2 GB Quantum Drive (VP31110) SCSI address pinning (address 5) The diag

Hard Disk Drive Tray 5.7 1.2 GB Seagate Drive (ST31200)3/96 Application Module X Service 65Honeywell Inc. 5.7 1.2 GB Seagate Drive (ST31200) Introdu

66 Application Module X Service 3/96Honeywell Inc. Hard Disk Drive Tray 5.7 1.2 GB Seagate Drive (ST31200) 1.2 GB Seagate drive address pinning The

Hard Disk Drive Tray 5.7 1.2 GB Seagate Drive (ST31200)3/96 Application Module X Service 67Honeywell Inc. Drive address 5 The diagram below illustra

68 Application Module X Service 3/96Honeywell Inc. Hard Disk Drive Tray 5.7 1.2 GB Seagate Drive (ST31200) 1.2 GB Seagate drive unused pinning There

Hard Disk Drive Tray 5.8 2 GB Quantum Drive (VP32210)3/96 Application Module X Service 69Honeywell Inc. 5.8 2 GB Quantum Drive (VP32210) Introductio

Table of Contents 3/96 Application Module X Service viHoneywell Inc. 5.9 2 GB Seagate Drive (ST32430N)Introduction ...

70 Application Module X Service 3/96Honeywell Inc. Hard Disk Drive Tray 5.8 2 GB Quantum Drive (VP32210) SCSI address pinning (address 5) The diagra

Hard Disk Drive Tray 5.9 2 GB Seagate Drive (ST32430N)3/96 Application Module X Service 71Honeywell Inc. 5.9 2 GB Seagate Drive (ST32430N)Introducti

72 Application ModuleX Service 3/96Honeywell Inc.Hard Disk Drive Tray5.9 2 GB Seagate Drive (ST32430N)SCSI address pinning (address 5)The diagram belo

Hard Disk Drive Tray5.10 2 GB Hewlett Packard Drive (C3325A)3/96 Application ModuleX Service 73Honeywell Inc.5.10 2 GB Hewlett Packard Drive (C3325A)I

74 Application ModuleX Service 3/96Honeywell Inc.Hard Disk Drive Tray5.10 2 GB Hewlett Packard Drive (C3325A)SCSI address pinning (address 5)The diagr

Hard Disk Drive Tray5.11 HDDT I/O Board3/96 Application ModuleX Service 75Honeywell Inc.5.11 HDDT I/O BoardDescription The HDDT I/O board interfaces w

76 Application ModuleX Service 3/96Honeywell Inc.Hard Disk Drive Tray5.12 Disk Drive/Drive Tray Replacement5.12 Disk Drive/Drive Tray ReplacementOverv

Hard Disk Drive Tray5.12 Disk Drive/Drive Tray Replacement3/96 Application ModuleX Service 77Honeywell Inc.Table 5-2 Drive Tray/Disk Drive Replacement

78 Application ModuleX Service 3/96Honeywell Inc.Hard Disk Drive Tray5.12 Disk Drive/Drive Tray ReplacementA coprocessor software recovery activity mu

Hard Disk Drive Tray5.13 HDDT I/O Board Replacement3/96 Application ModuleX Service 79Honeywell Inc.5.13 HDDT I/O Board ReplacementOverview Node power

Table of Contents 3/96 Application Module X Service viiHoneywell Inc. 7.3 Modem ConnectionOverview ...

80 Application ModuleX Service 3/96Honeywell Inc.Hard Disk Drive Tray5.13 HDDT I/O Board ReplacementHDDT I/O Board Removal/Replacement ProcedureTable

3/96 Application Module X Service 81Honeywell Inc. Section 6—Coprocessor Console6.1 Overview Requirements for coprocessor console A console terminal

82 Application Module X Service 3/96Honeywell Inc. Coprocessor Console 6.1 Overview Overview of activities to be performed There are several distinc

Coprocessor Console 6.2 Coprocessor Terminal Description and Configuration3/96 Application Module X Service 83Honeywell Inc. 6.2 Coprocessor Termina

84 Application Module X Service 3/96Honeywell Inc. Coprocessor Console 6.3 Coprocessor Console Terminal Connection 6.3 Coprocessor Console Terminal

Coprocessor Console 6.3 Coprocessor Console Terminal Connection3/96 Application Module X Service 85Honeywell Inc. Coprocessor console terminal inter

86 Application Module X Service 3/96Honeywell Inc. Coprocessor Console 6.3 Coprocessor Console Terminal Connection 9 to 9 pin cable Note: The dashed

Coprocessor Console 6.3 Coprocessor Console Terminal Connection3/96 Application Module X Service 87Honeywell Inc. . Note: The cable connection to th

88 Application Module X Service 3/96Honeywell Inc. Coprocessor Console 6.3 Coprocessor Console Terminal Connection * This cable is not supplied with

3/96 Application Module X Service 89Honeywell Inc. Section 7—TAC Access to Coprocessor7.1 Overview TAC support for coprocessor problems The Technica