Seagate ST32430N Spezifikationen

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Inhaltsverzeichnis

Seite 1 - Application Module

Application ModuleXServiceAX13-510

Seite 2

Introduction – References8 Application ModuleX Service 12/01Honeywell1.2 ReferencesFor more informationThe following documentation is referenced from

Seite 3

Coprocessor Console – Overview98 Application ModuleX Service 12/01Honeywell• Ensure the terminal emulation software is activated (if using apersonal

Seite 4 - Screen/program data

Coprocessor Console – Coprocessor Terminal Description and Configuration12/01 Application ModuleX Service 99Honeywell6.2 Coprocessor Terminal Descript

Seite 5 - Contents

Coprocessor Console – Coprocessor Console Terminal Connection100 Application ModuleX Service 12/01Honeywell6.3 Coprocessor Console Terminal Connection

Seite 6

Coprocessor Console – Coprocessor Console Terminal Connection12/01 Application ModuleX Service 101HoneywellCoprocessorconsole terminalinterface cables

Seite 7

Coprocessor Console – Coprocessor Console Terminal Connection102 Application ModuleX Service 12/01Honeywell9to9pincable40070123456789123456789"Y&

Seite 8

Coprocessor Console – Coprocessor Console Terminal Connection12/01 Application ModuleX Service 103HoneywellTable 6-1 Terminal Connection ProcedureStep

Seite 9 - 1.1 About This Document

Coprocessor Console – Coprocessor Console Terminal Connection104 Application ModuleX Service 12/01HoneywellNote: The cable connection to the UXS is di

Seite 10 - 1.2 References

12/01 Application ModuleX Service 105Honeywell7. TAC Access to Coprocessor7.1 OverviewTAC support forcoprocessorproblemsThe Technical Assistance Cente

Seite 11 - M Functionality

TAC Access to Coprocessor – Overview106 Application ModuleX Service 12/01HoneywellOverview ofactivities toenable TACaccessThere are several distinct t

Seite 12 - Software

TAC Access to Coprocessor – Communications Modem Description and Configuration12/01 Application ModuleX Service 107Honeywell7.2 Communications Modem D

Seite 13 - 2.2 Hardware Organization

12/01 Application ModuleX Service 9Honeywell2. Application ModuleX2.1 AXM FunctionalityGeneralintroductionThe Application ModuleX(AXM) provides the fu

Seite 14

TAC Access to Coprocessor – Communications Modem Description and Configuration108 Application ModuleX Service 12/01HoneywellModemconfigurationregister

Seite 15 - 2.3 Board Slot Definition

TAC Access to Coprocessor – Communications Modem Description and Configuration12/01 Application ModuleX Service 109HoneywellRequired modemconfiguratio

Seite 16

TAC Access to Coprocessor – Modem Connection110 Application ModuleX Service 12/01Honeywell7.3 Modem ConnectionOverviewAn interface cable must be conne

Seite 17

TAC Access to Coprocessor – Modem Connection12/01 Application ModuleX Service 111HoneywellModem interfacecable schematicAn example of the modem interf

Seite 18 - 2.4 Power Supply

TAC Access to Coprocessor – Modem Connection112 Application ModuleX Service 12/01HoneywellTable 7-3 Modem Connection ProcedureStep Action1Make sure th

Seite 19 - 3.1 K2LCN-X Node Processor

12/01 Application ModuleX Service 113Honeywell8. HP 712/60 PA RISC Desktop Workstation8.1 HP 712/60 Workstation in AXM EnvironmentOverview of HP712/60

Seite 20

HP 712/60 PA RISC Desktop Workstation – HP 712/60 Workstation in AXM Environment114 Application ModuleX Service 12/01HoneywellHP 712/60workstationconn

Seite 21

12/01 Application ModuleX Service 115Honeywell9. DAT DRIVE9.1 IntroductionDAT drive purposeA directly connected Digital Audio Tape (DAT) drive is an o

Seite 22

DAT DRIVE – DAT Drive Indicators116 Application ModuleX Service 12/01Honeywell9.2 DAT Drive IndicatorsDAT indicatordefinitionThe DAT drive front panel

Seite 23

DAT DRIVE – Preventive Maintenance12/01 Application ModuleX Service 117Honeywell9.3 Preventive MaintenanceDAT head cleaningThe DAT drive heads require

Seite 24 - 3.2 K4LCN-X Node Processor

Application ModuleX – AXM Functionality10 Application ModuleX Service 12/01HoneywellFunctionalityDiagramThe following diagram illustrates that there a

Seite 25 - LCN Address Pinning

DAT DRIVE – DAT Drive Physical Configuration and Cabling118 Application ModuleX Service 12/01Honeywell9.4 DAT Drive Physical Configuration and Cabling

Seite 26

DAT DRIVE – DAT Drive Physical Configuration and Cabling12/01 Application ModuleX Service 119HoneywellDAT SCSIinterfaceterminationThe termination for

Seite 27

DAT DRIVE – DAT Drive Physical Configuration and Cabling120 Application ModuleX Service 12/01HoneywellDAT optionswitchesInternal DAT drive options are

Seite 28

DAT DRIVE – DAT Drive Physical Configuration and Cabling12/01 Application ModuleX Service 121HoneywellDAT connection(no CD-ROM)The following diagram i

Seite 29 - K4LCN Memory

DAT DRIVE – DAT Drive Physical Configuration and Cabling122 Application ModuleX Service 12/01HoneywellDAT connection(with CD-ROM)The following diagram

Seite 30

DAT DRIVE – DAT Replacement12/01 Application ModuleX Service 123Honeywell9.5 DAT ReplacementOverviewNode power must be turned off for the purpose of c

Seite 31 - HMPU Indicators

DAT DRIVE – DAT Replacement124 Application ModuleX Service 12/01HoneywellTable 9-3 DAT Replacement ProcedureStep Action1Perform an orderly shutdown of

Seite 32

12/01 Application ModuleX Service 125Honeywell10. Section 10—CD-ROM Drive10.1 IntroductionCD-ROM purposeA directly connected CD-ROM drive is an option

Seite 33

Section 10—CD-ROM Drive – CD-ROM Physical Configuration and Cabling126 Application ModuleX Service 12/01Honeywell10.2 CD-ROM Physical Configuration an

Seite 34

Section 10—CD-ROM Drive – CD-ROM Physical Configuration and Cabling12/01 Application ModuleX Service 127HoneywellCD-ROM pinning(with DAT drive)The SCS

Seite 35

Application ModuleX – Hardware Organization12/01 Application ModuleX Service 11Honeywell2.2 Hardware OrganizationAXM Hardwareblock diagramTwo versions

Seite 36

Section 10—CD-ROM Drive – CD-ROM Physical Configuration and Cabling128 Application ModuleX Service 12/01HoneywellCD-ROM powerPower to the CD-ROM drive

Seite 37 - LCN cable

Section 10—CD-ROM Drive – CD-ROM Physical Configuration and Cabling12/01 Application ModuleX Service 129HoneywellCD-ROMconnection (withDAT drive)The f

Seite 38

Section 10—CD-ROM Drive – CD-ROM Replacement130 Application ModuleX Service 12/01Honeywell10.3 CD-ROM ReplacementOverviewNode power must be turned off

Seite 39 - WSI2 board

Section 10—CD-ROM Drive – CD-ROM Replacement12/01 Application ModuleX Service 131HoneywellReplacementprocedureThe following procedure outlines the ste

Seite 40

Section 10—CD-ROM Drive – CD-ROM Replacement132 Application ModuleX Service 12/01Honeywell

Seite 41

12/01 Application ModuleX Service 133Honeywell11. Spare Parts11.1 OverviewOrganization of thissectionThis section lists the field replaceable parts fo

Seite 42 - Assembly

Spare Parts – Basic 5-Slot Module Parts134 Application ModuleX Service 12/01Honeywell11.2 Basic 5-Slot Module PartsBasic 5-slot partslistThe table on

Seite 43

Spare Parts – Basic 5-Slot Module Parts12/01 Application ModuleX Service 135HoneywellTable 11-1 5-Slot Module Parts List for Normal Production UnitsAs

Seite 44 - (Single Board)

Spare Parts – Basic 10-Slot Module Parts136 Application ModuleX Service 12/01Honeywell11.3 Basic 10-Slot Module PartsBasic 10-Slotparts listThe follow

Seite 45 - (Each Board)

Spare Parts – LCN Node Processor Parts12/01 Application ModuleX Service 137Honeywell11.4 LCN Node Processor PartsNode processorparts listThe following

Seite 46 - 64 Megabytes

Application ModuleX – Hardware Organization12 Application ModuleX Service 12/01HoneywellK2LCN/K4LCNhardware version40134Local Control Network(LCN)CLCN

Seite 47

Spare Parts – Coprocessor and Related Parts138 Application ModuleX Service 12/01Honeywell11.5 Coprocessor and Related PartsWSI2 and WSI2 I/OTable 11-4

Seite 48

Spare Parts – Coprocessor and Related Parts12/01 Application ModuleX Service 139HoneywellThe optional coprocessor memory sizes and coprocessor battery

Seite 49 - Coprocessor PIN

Spare Parts – Coprocessor and Related Parts140 Application ModuleX Service 12/01HoneywellCoprocessor PINconnectionhardwareTable 11-6 PIN Connection Ha

Seite 50

Spare Parts – Hard Disk Drive Tray and Drive Parts12/01 Application ModuleX Service 141Honeywell11.6 Hard Disk Drive Tray and Drive PartsTray and Driv

Seite 51

Spare Parts – DAT Tape and Associated Parts142 Application ModuleX Service 12/01Honeywell11.7 DAT Tape and Associated PartsIntroductionATTENTIONThe DA

Seite 52 - Terminal

Spare Parts – DAT Tape and Associated Parts12/01 Application ModuleX Service 143HoneywellDAT drive inClassic furniturestationThe following table provi

Seite 53 - LANTRONIX

Spare Parts – DAT Tape and Associated Parts144 Application ModuleX Service 12/01HoneywellDAT drive inErgonomic orClassic table-topwork surfaceThe foll

Seite 54 - Media Access Unit

Spare Parts – CD-ROM and Associated Parts12/01 Application ModuleX Service 145Honeywell11.8 CD-ROM and Associated PartsIntroductionATTENTIONThe CD-ROM

Seite 55 - 4.4 WSI2 Board Replacement

Spare Parts – CD-ROM and Associated Parts146 Application ModuleX Service 12/01HoneywellCD-ROM in classicfurniture stationThe following table provides

Seite 56

12/01 Application ModuleX Service 147HoneywellIndex110-Slot board placement, 1410-Slot board replacement, 1455-Slot board replacement, 13AAXM function

Seite 57

Application ModuleX – Board Slot Definition12/01 Application ModuleX Service 13Honeywell2.3 Board Slot DefinitionOverview ofchassis typesThe AXM will

Seite 58

148 Application ModuleX Service 12/01HoneywellModem interface cable schematic, 111NNode power margin restrictions, 16OOperation and media handling, 11

Seite 59

Fax Transmittal Fax No.: (602) 313-4212Reader CommentsTo: Information DevelopmentFrom: Name Date:Title:Company:Address:City: State: Zip:Telephone: Fax

Seite 62

Industrial Automation and ControlHoneywell16404 North Black Canyon HighwayPhoenix, AZ 85053

Seite 63

Application ModuleX – Board Slot Definition14 Application ModuleX Service 12/01HoneywellTable 2-2 Five-Slot Chassis Board Locations (with 256 MB Copro

Seite 64

Application ModuleX – Board Slot Definition12/01 Application ModuleX Service 15HoneywellTable 2-3 Ten-Slot Chassis Board LocationsSlot Front Rear10 Un

Seite 65

Application ModuleX – Power Supply16 Application ModuleX Service 12/01Honeywell2.4 Power SupplyIntroductionThe AXM node contains a power supply (55 am

Seite 66

12/01 Application ModuleX Service 17Honeywell3. Hardware Description of LCN Node Processors3.1 K2LCN-X Node ProcessorOverviewThe K2LCN processor board

Seite 68

Hardware Description of LCN Node Processors – K2LCN-X Node Processor18 Application ModuleX Service 12/01HoneywellThe indicators on the latest producti

Seite 69 - Connector

Hardware Description of LCN Node Processors – K2LCN-X Node Processor12/01 Application ModuleX Service 19HoneywellIndicatordescriptionThe following tab

Seite 70

Hardware Description of LCN Node Processors – K2LCN-X Node Processor20 Application ModuleX Service 12/01HoneywellK2LCN PinningThe K2LCN board has an L

Seite 71 - Resistor Modules

Hardware Description of LCN Node Processors – K2LCN-X Node Processor12/01 Application ModuleX Service 21Honeywell400029D9F9H9CTS2Jumper Removed = &quo

Seite 72 - Termination Jumper Block

Hardware Description of LCN Node Processors – K4LCN-X Node Processor22 Application ModuleX Service 12/01Honeywell3.2 K4LCN-X Node ProcessorOverviewThe

Seite 73 - No Jumpers

Hardware Description of LCN Node Processors – K4LCN-X Node Processor12/01 Application ModuleX Service 23HoneywellASSY. NO.Memory BoardLCN Address Pinn

Seite 74

Hardware Description of LCN Node Processors – K4LCN-X Node Processor24 Application ModuleX Service 12/01HoneywellK4LCN indicatorsThe K4LCN board indic

Seite 75

Hardware Description of LCN Node Processors – K4LCN-X Node Processor12/01 Application ModuleX Service 25HoneywellTable 3-2 K4LCN Board IndicatorsLED D

Seite 76 - “Busy” indicator

Hardware Description of LCN Node Processors – K4LCN-X Node Processor26 Application ModuleX Service 12/01HoneywellK4LCN PinningThe K4LCN board has an L

Seite 77

Hardware Description of LCN Node Processors – K4LCN-X Node Processor12/01 Application ModuleX Service 27HoneywellK4LCN MemoryMemory for the K4LCN boar

Seite 78

Application ModuleXApplication ModuleXServiceAX13-510Release 110/200CE Compliant12/01

Seite 79

Hardware Description of LCN Node Processors – K4LCN-X Node Processor28 Application ModuleX Service 12/01Honeywell16570ASSY. NO.Memory BoardLCN Address

Seite 80 - Introduction

Hardware Description of LCN Node Processors – HMPU Processor and Associated Boards12/01 Application ModuleX Service 29Honeywell3.3 HMPU Processor and

Seite 81

Hardware Description of LCN Node Processors – HMPU Processor and Associated Boards30 Application ModuleX Service 12/01HoneywellIndicatordescriptionThe

Seite 82

Hardware Description of LCN Node Processors – HMPU Processor and Associated Boards12/01 Application ModuleX Service 31HoneywellLLCN boardfunctionality

Seite 83

Hardware Description of LCN Node Processors – HMPU Processor and Associated Boards32 Application ModuleX Service 12/01HoneywellLLCN indicatordescripti

Seite 84

Hardware Description of LCN Node Processors – HMPU Processor and Associated Boards12/01 Application ModuleX Service 33HoneywellQMEM indicatorsThe QMEM

Seite 85

Hardware Description of LCN Node Processors – CLCN A/B I/O Board (or LCN I/O Board)34 Application ModuleX Service 12/01Honeywell3.4 CLCN A/B I/O Board

Seite 86

Hardware Description of LCN Node Processors – CLCN A/B I/O Board (or LCN I/O Board)12/01 Application ModuleX Service 35HoneywellLCN cableconnectionsTh

Seite 87

Hardware Description of LCN Node Processors – Node Processor Related Board Replacement36 Application ModuleX Service 12/01Honeywell3.5 Node Processor

Seite 88

12/01 Application ModuleX Service 37Honeywell4. Hardware Description of Coprocessor4.1 WSI2 Board DescriptionOverviewThe basic WSI2 board contains the

Seite 89

Copyright, Notices, and TrademarksCopyright 1995-1999 by Honeywell Inc.Revision 05 – December 13, 2001While this information is presented in good fait

Seite 90

Hardware Description of Coprocessor – WSI2 Board Description38 Application ModuleX Service 12/01HoneywellWSI2 Boardindicators (LEDs)and switchThe diag

Seite 91

Hardware Description of Coprocessor – WSI2 Board Description12/01 Application ModuleX Service 39HoneywellWSI2 boardindicatorsThe diagram below describ

Seite 92

Hardware Description of Coprocessor – WSI2 Board Description40 Application ModuleX Service 12/01HoneywellCalender clockbatteryThe coprocessor contains

Seite 93 - 5.12 HDDT I/O Board

Hardware Description of Coprocessor – WSI2 Board Description12/01 Application ModuleX Service 41HoneywellCoprocessormemoryThe coprocessor, which plugs

Seite 94

Hardware Description of Coprocessor – WSI2 Board Description42 Application ModuleX Service 12/01HoneywellCoprocessormemory option(32 megabytes)The fol

Seite 95

Hardware Description of Coprocessor – WSI2 Board Description12/01 Application ModuleX Service 43HoneywellCoprocessormemory option(64 megabytes)The fol

Seite 96

Hardware Description of Coprocessor – WSI2 Board Description44 Application ModuleX Service 12/01HoneywellCoprocessormemory option(128 megabyte)The ill

Seite 97

Hardware Description of Coprocessor – WSI2 Board Description12/01 Application ModuleX Service 45HoneywellCoprocessormemory option(265 megabyte)The ill

Seite 98

Hardware Description of Coprocessor – WSI2 Board Description46 Application ModuleX Service 12/01HoneywellCoprocessor freeedgeThe illustration below sh

Seite 99 - 6.1 Overview

Hardware Description of Coprocessor – WSI2 Board Description12/01 Application ModuleX Service 47HoneywellCoprocessor PINconnection detailsThe coproces

Seite 100

12/01 Application ModuleX Service iiiHoneywellContents1. INTRODUCTION...

Seite 101

Hardware Description of Coprocessor – WSI2 Board Description48 Application ModuleX Service 12/01HoneywellCoprocessor SCSIinterface detailsThe coproces

Seite 102

Hardware Description of Coprocessor – WSI2 Board Description12/01 Application ModuleX Service 49HoneywellLicense keyHoneywell provides the appropriate

Seite 103

Hardware Description of Coprocessor – WSI2 I/O Board Description50 Application ModuleX Service 12/01HoneywellThe Honeywell license key information (co

Seite 104

Hardware Description of Coprocessor – Media Access Unit (MAU) Description12/01 Application ModuleX Service 51HoneywellLTX-2Thin Coax TransceiverIEEE 8

Seite 105

Hardware Description of Coprocessor – Media Access Unit (MAU) Description52 Application ModuleX Service 12/01HoneywellMedia Access UnitconnectionThe f

Seite 106

Hardware Description of Coprocessor – WSI2 Board Replacement12/01 Application ModuleX Service 53Honeywell4.4 WSI2 Board ReplacementOverviewNode power

Seite 107 - 7.1 Overview

Hardware Description of Coprocessor – WSI2 Board Replacement54 Application ModuleX Service 12/01HoneywellWSI2 BoardReplacementProcedureTable 4-3 WSI2

Seite 108

Hardware Description of Coprocessor – WSI2 Board Replacement12/01 Application ModuleX Service 55HoneywellTable 4-3 WSI2 Board Replacement ProcedureSte

Seite 109

Hardware Description of Coprocessor – WSI2 I/O Board replacement56 Application ModuleX Service 12/01Honeywell4.5 WSI2 I/O Board replacementOverviewNod

Seite 110

Hardware Description of Coprocessor – WSI2 I/O Board replacement12/01 Application ModuleX Service 57HoneywellWSI2 I/O BoardReplacementProcedureTable 4

Seite 111

Contentsiv Application ModuleX Service 12/01Honeywell5.12 HDDT I/O Board ...

Seite 112 - 7.3 Modem Connection

Hardware Description of Coprocessor – WSI2 I/O Board replacement58 Application ModuleX Service 12/01Honeywell

Seite 113

12/01 Application ModuleX Service 59Honeywell5. Hard Disk Drive Tray5.1 Drive Tray DescriptionOverviewThe Hard Disk Drive Tray (HDDT) contains the cop

Seite 114

Hard Disk Drive Tray – Drive Tray Description60 Application ModuleX Service 12/01HoneywellDisk drivephysicalplacement andconnectionsThe diagram below

Seite 115 - M Environment

Hard Disk Drive Tray – Drive Tray Description12/01 Application ModuleX Service 61HoneywellDrive connectiondetailThe following illustration gives great

Seite 116

Hard Disk Drive Tray – Drive Tray Description62 Application ModuleX Service 12/01HoneywellDisk drivesSeveral types of disk drives are available for us

Seite 117 - 9. DAT DRIVE

Hard Disk Drive Tray – Drive Tray Description12/01 Application ModuleX Service 63HoneywellConsiderations fororderingreplacementdrivesThe only thing to

Seite 118 - 9.2 DAT Drive Indicators

Hard Disk Drive Tray – Drive Tray Description64 Application ModuleX Service 12/01HoneywellIf the primary drive is replaced by a drive that was the sec

Seite 119

Hard Disk Drive Tray – 525 MB Quantum Disk Drive (LPS525S)12/01 Application ModuleX Service 65Honeywell5.2 525 MB Quantum Disk Drive (LPS525S)Introduc

Seite 120 - DAT SCSI address

Hard Disk Drive Tray – 525 MB Quantum Disk Drive (LPS525S)66 Application ModuleX Service 12/01HoneywellThe following diagram is the same as the previo

Seite 121

Hard Disk Drive Tray – 525 MB Seagate Drive (ST3600N)12/01 Application ModuleX Service 67Honeywell5.3 525 MB Seagate Drive (ST3600N)IntroductionThe di

Seite 122

Tables12/01 Application ModuleX Service vHoneywellTablesTable 2-1 Five-Slot Chassis Board Locations (32/64/128 MB Coprocessor Memory Sizes) ...

Seite 123 - (no CD-ROM)

Hard Disk Drive Tray – 525 MB Seagate Drive (ST3600N)68 Application ModuleX Service 12/01HoneywellThe following diagram is the same as the previous di

Seite 124 - (with CD-ROM)

Hard Disk Drive Tray – 525 MB Seagate Drive (ST3600N)12/01 Application ModuleX Service 69Honeywell525 MB Seagatedrive SCSIinterfaceterminationThe Seag

Seite 125 - 9.5 DAT Replacement

Hard Disk Drive Tray – 525 MB Seagate Drive (ST3600N)70 Application ModuleX Service 12/01Honeywell525 MB Seagatedrive termination/parity pinningBoth d

Seite 126

Hard Disk Drive Tray – 525 MB Seagate Drive (ST3600N)12/01 Application ModuleX Service 71Honeywell525 MB Seagatedrive unusedpinningThere are no option

Seite 127 - 10.1 Introduction

Hard Disk Drive Tray – GB Digital Equipment Corp. Drive (DSP3107L)72 Application ModuleX Service 12/01Honeywell5.4 GB Digital Equipment Corp. Drive (D

Seite 128

Hard Disk Drive Tray – GB Digital Equipment Corp. Drive (DSP3107L)12/01 Application ModuleX Service 73Honeywell1.2 GB DEC driveSCSI addresspinning(add

Seite 129 - (with DAT drive)

Hard Disk Drive Tray – GB Quantum Drive (LPS1080S)74 Application ModuleX Service 12/01Honeywell5.5 GB Quantum Drive (LPS1080S)IntroductionThe diagram

Seite 130

Hard Disk Drive Tray – GB Quantum Drive (LPS1080S)12/01 Application ModuleX Service 75HoneywellSCSI addresspinning(address 5)The diagram below is iden

Seite 131

Hard Disk Drive Tray – GB Quantum Drive (VP31110)76 Application ModuleX Service 12/01Honeywell5.6 GB Quantum Drive (VP31110)IntroductionThe diagram be

Seite 132 - 10.3 CD-ROM Replacement

Hard Disk Drive Tray – GB Quantum Drive (VP31110)12/01 Application ModuleX Service 77HoneywellSCSI addresspinning(address 5)The diagram below is ident

Seite 133 - CD-ROM drive

Tablesvi Application ModuleX Service 12/01Honeywell

Seite 134

Hard Disk Drive Tray – GB Seagate Drive (ST31200)78 Application ModuleX Service 12/01Honeywell5.7 GB Seagate Drive (ST31200)IntroductionThe diagram sh

Seite 135 - 11.1 Overview

Hard Disk Drive Tray – GB Seagate Drive (ST31200)12/01 Application ModuleX Service 79Honeywell1.2 GB Seagatedrive addresspinningThe pinning to define

Seite 136

Hard Disk Drive Tray – GB Seagate Drive (ST31200)80 Application ModuleX Service 12/01Honeywell1.2 GB Seagatedrive termination/parity pinningBoth drive

Seite 137

Hard Disk Drive Tray – GB Seagate Drive (ST31200)12/01 Application ModuleX Service 81Honeywell1.2 GB Seagatedrive unusedpinningThere are no option jum

Seite 138 - M node in a 10

Hard Disk Drive Tray – 2 GB Quantum Drive (VP32210)82 Application ModuleX Service 12/01Honeywell5.8 2 GB Quantum Drive (VP32210)IntroductionThe diagra

Seite 139 - 11.4 LCN Node Processor Parts

Hard Disk Drive Tray – 2 GB Quantum Drive (VP32210)12/01 Application ModuleX Service 83HoneywellSCSI addresspinning(address 5)The diagram below is ide

Seite 140 - ATTENTION

Hard Disk Drive Tray – 2 GB Seagate Drive (ST32430N)84 Application ModuleX Service 12/01Honeywell5.9 2 GB Seagate Drive (ST32430N)IntroductionThe diag

Seite 141

Hard Disk Drive Tray – 2 GB Seagate Drive (ST32430N)12/01 Application ModuleX Service 85HoneywellSCSI addresspinning(address 5)The diagram below is id

Seite 142

Hard Disk Drive Tray – 2 GB Hewlett Packard Drive (C3325A)86 Application ModuleX Service 12/01Honeywell5.10 2 GB Hewlett Packard Drive (C3325A)Introdu

Seite 143 - Tray and the disk drives

Hard Disk Drive Tray – 2 GB Hewlett Packard Drive (C3325A)12/01 Application ModuleX Service 87Honeywell2GBHPdriveSCSI addresspinning(address 6)The dia

Seite 144

12/01 Application ModuleX Service 7Honeywell1. Introduction1.1 About This DocumentBasicsPurposeThis manual provides instructions for maintenance and r

Seite 145

Hard Disk Drive Tray – 2 GB Hewlett Packard Drive (C3325A)88 Application ModuleX Service 12/01HoneywellSCSI addresspinning(address 5)The diagram below

Seite 146

Hard Disk Drive Tray – 4 GB Seagate Drive (ST34572N)12/01 Application ModuleX Service 89Honeywell5.11 4 GB Seagate Drive (ST34572N)4 GB Seagatedrive (

Seite 147

Hard Disk Drive Tray – 4 GB Seagate Drive (ST34572N)90 Application ModuleX Service 12/01Honeywell4 GB Seagatedrive (ST34572N)SCSI pinning(address 5)Th

Seite 148

Hard Disk Drive Tray – HDDT I/O Board12/01 Application ModuleX Service 91Honeywell5.12 HDDT I/O BoardDescriptionThe HDDT I/O board interfaces with the

Seite 149 - Sportser 9600

Hard Disk Drive Tray – Disk Drive/Drive Tray Replacement92 Application ModuleX Service 12/01Honeywell5.13 Disk Drive/Drive Tray ReplacementOverviewNod

Seite 150 - Recommended modem, 107

Hard Disk Drive Tray – Disk Drive/Drive Tray Replacement12/01 Application ModuleX Service 93HoneywellTable 5-2 Drive Tray/Disk Drive Replacement Proce

Seite 151 - Service, AX13-510, 12/01

Hard Disk Drive Tray – Disk Drive/Drive Tray Replacement94 Application ModuleX Service 12/01HoneywellA coprocessor software recovery activity must be

Seite 152

Hard Disk Drive Tray – HDDT I/O Board Replacement12/01 Application ModuleX Service 95Honeywell5.14 HDDT I/O Board ReplacementOverviewNode power must b

Seite 153

Hard Disk Drive Tray – HDDT I/O Board Replacement96 Application ModuleX Service 12/01HoneywellHDDT I/O BoardRemoval/ReplacementProcedureTable 5-3 HDDT

Seite 154 - Phoenix, AZ 85053

12/01 Application ModuleX Service 97Honeywell6. Coprocessor Console6.1 OverviewRequirements forcoprocessorconsoleA console terminal connection to the

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